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Volume 343 - Topical Workshop on Electronics for Particle Physics (TWEPP2018) - Posters
Characterization of Soft Error Rate Against Memory Elements Spacing and Clock Skew in a Logic with Triple Modular Redundancy in a 65nm Process
S. Miryala,* T. Hemperek, M. Menouni
*corresponding author
Full text: pdf
Pre-published on: 2019 May 20
Published on: 2019 July 25
Abstract
Single Event Effects introduce soft errors in ASICs. Design methodologies like Triple Modular
Redundancy (TMR) with clock skew insertion, a system level redundancy technique is a common
practice by designers to mitigate soft errors. However, the optimal spacing between memory
elements in a TMR in 65nm process hasn't been addressed so far. RD53SEU is a mini ASIC
development under the framework of the CERN RD53 collaboration to characterize the soft error
rates against the separation spacing and clock skew between memory elements in a TMR. This
article describes the architecture and design aspects of the various test structures on the RD53SEU
test chip.
DOI: https://doi.org/10.22323/1.343.0029
Open Access
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