This article discusses design considerations for the mechanical structures of tracking systems currently under construction or being planned. The prime challenges are a high stiffness-to-mass ratio and good thermal conductivity between the heat sources (front-end electronics and sensors) and the local heat sink (coolant). These concepts will be illustrated with a few case studies of tracking systems under construction or in planning.
Advanced mechanics for silicon tracker
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Pre-published on:
September 03, 2019
Published on:
September 06, 2019
Abstract
DOI: https://doi.org/10.22323/1.348.0047
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Copyright owned by the author(s) under the term of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Copyright owned by the author(s) under the term of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.