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Volume 348 - The 27th International Workshop on Vertex Detectors (VERTEX2018) - Main session
Advanced mechanics for silicon tracker
G. Viehhauser
Full text: pdf
Pre-published on: 2019 September 03
Published on: 2019 September 06
This article discusses design considerations for the mechanical structures of tracking systems currently under construction or being planned. The prime challenges are a high stiffness-to-mass ratio and good thermal conductivity between the heat sources (front-end electronics and sensors) and the local heat sink (coolant). These concepts will be illustrated with a few case studies of tracking systems under construction or in planning.
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