Main Image
Volume 348 - The 27th International Workshop on Vertex Detectors (VERTEX2018) - Main session
Advanced mechanics for silicon tracker
G. Viehhauser
Full text: pdf
Pre-published on: 2019 September 03
Published on: 2019 September 06
Abstract
This article discusses design considerations for the mechanical structures of tracking systems currently under construction or being planned. The prime challenges are a high stiffness-to-mass ratio and good thermal conductivity between the heat sources (front-end electronics and sensors) and the local heat sink (coolant). These concepts will be illustrated with a few case studies of tracking systems under construction or in planning.
DOI: https://doi.org/10.22323/1.348.0047
Open Access
Creative Commons LicenseCopyright owned by the author(s) under the term of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.