PoS - Proceedings of Science
Volume 370 - Topical Workshop on Electronics for Particle Physics (TWEPP2019) - Packaging and Interconnects
Prototyping of Hybrid Circuits for the CMS Phase-2 Outer Tracker Upgrade at the HL-LHC
G. Blanchot,* A. Honma, M. Kovacs, N. Rasevic, A. La Rosa, A. Zografos, T. Gadek on behalf of the CMS collaboration
*corresponding author
Full text: pdf
Pre-published on: March 06, 2020
Published on: April 21, 2020
High Density Interconnect hybrids are being developed for the CMS tracker Phase-2 upgrade for the HL-LHC. These hybrids are flexible circuits laminated to carbon fiber composite stiffeners and are assembled with flip-chips, passives and connectors. The wire bonding to sensors and the soldering requirements for these components requires an almost perfectly flat surface. A lamination process is proposed, focused on the compatibility with a lead-free reflow process. The stack-up of the hybrid was optimized to balance the forces induced by the Coefficient of Thermal Expansion (CTE) differences in the assembly. The proposed lamination process was applied to prototype 8CBC3 hybrid circuits.
DOI: https://doi.org/10.22323/1.370.0060
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