Volume 373 - The 28th International Workshop on Vertex Detectors (Vertex2019) - Vertex detector subsystems
MuPix chips, mechanics and cooling systems of Mu3e experiment
F. Meier,* M. Deflorin, L.O.S. Noehte
*corresponding author
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Pre-published on: 2020 March 24
Published on:
Abstract
Mu3e is an upcoming experiment at Paul Scherrer Institut in the search for the strongly suppressed decay of $\mu\rightarrow eee$. It will use an ultra-lightweight silicon pixel detector using thinned HV-CMOS MAPS chips. Multiple Coulomb scattering is further kept under control with using high density interconnects made of aluminium and operating the detector in a helium atmosphere. More than 1 m$^2$ of instrumented surface will produce about 3.3 kW of heat ($\leq$ 250 mW/cm$^2$). Traditional cooling approaches are in conflict with the low-mass requirements, hence a gaseous helium flow cooling system will be implemented. This talk will give a report on the successful data transmission tests with the aluminium interconnects at target speeds of 1.25 Gbit/s under realistic condition. The final proof-of-concept of the helium cooling has been achieved with comprehensive cooling simulations and successfully confirmed with laboratory measurements using a full-scale mockup of the vertex pixel detector.
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