PoS - Proceedings of Science
Volume 390 - 40th International Conference on High Energy physics (ICHEP2020) - Parallel: Detectors for Future Facilities (incl. HL-LHC), R&D, Novel Techniques
ATLAS ITk Pixel Detector Overview
S. Terzo* on behalf of the ATLAS collaboration
*corresponding author
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Pre-published on: February 11, 2021
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For the HL-LHC upgrade the current ATLAS Inner Detector is replaced by an all-silicon system. The Pixel Detector will consist of 5 barrel layers and a number of rings, resulting in about 14$~\mathrm{m^2}$ of instrumented area. Due to the huge non-ionizing fluence (over 2e16$~\mathrm{n_{eq}/cm^2}$ and ionizing dose (larger than 5 MGy), the two innermost layers, instrumented with 3D pixel sensors (L0) and 100$~\mathrm{\mu m}$ thin planar sensors (L1) will be replaced after about 5 years of operation. All hybrid detector modules will be read out by novel ASICs, implemented in 65 nm CMOS technology, with a bandwidth of up to 5 Gb/s. Data will be transmitted optically to the off-detector readout system. To save material in the servicing cables, serial powering is employed for low voltage. Large scale prototyping programmes are being carried out by all sub-systems. This paper will give an overview of the layout and current status of the development of the ITk Pixel Detector.
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