Volume 414 - 41st International Conference on High Energy physics (ICHEP2022) - Detectors for Future Facilities, R&D, novel techniques
Picosecond timing resolution with 3D trench silicon sensors
F. Borgato*, D. Brundu, A. Cardini, G. Matteo Cossu, G. -Franco Dalla Betta, M. Garau, L. La Delfa, A. Lampis, A. Lai, A. Loi, M. Margherita Obertino, S. Vecchi and G. Simi
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Pre-published on: December 12, 2022
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Abstract
Future vertex detectors operating in colliders at very high instantaneous luminosity will face great challenges in the event reconstruction due to the increase in track density. To guarantee good detector performance the additional information of the hit time stamping will be fundamental. In this paper the potentiality of the 3D trench silicon pixels developed by the INFN TimeSPOT collaboration is discussed. The latest results from a beam test at SPS/H8 are presented, showing a time resolution of the order of 10 ps for both irradiated ($2.5\cdot 10^{16}$ 1 MeV n$_{eq}$/cm$^2$) and non-irradiated pixels featuring a detection efficiency close to 99% with the sensors properly tilted. For such characteristics, the 3D trench silicon pixels have proved to be a promising option for future vertex detectors operating at very high instantaneous luminosity.
DOI: https://doi.org/10.22323/1.414.0350
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