In the high-luminosity era of the Large Hadron Collider, the instantaneous luminosity is expected to reach unprecedented values, resulting in up to 200 proton-proton interactions in a typical bunch crossing.
To cope with the resulting increases in occupancy, bandwidth, and radiation levels, the ATLAS Inner Detector will be replaced by the all-silicon Inner Tracker (ITk).
The innermost part of the ITk will consist of a pixel detector, with an active area of about 13 m$^2$.
To meet requirements in terms of radiation hardness, power dissipation, and production yield, several silicon sensor technologies are adopted in the five barrel and endcap layers.
The project is moving toward production of components – sensors, module assemblies, mechanical structures, and services.
The pixel modules assembled with ITkPixV2 readout chips have been built to evaluate their production rates.
Irradiation campaigns have been conducted to evaluate thermal and electrical performance before and after irradiation.
A new powering scheme – serial – will be employed in the ITk pixel detector, helping to reduce both the material thickness of the detector and power dissipation.
This contribution presents the status of the ITk-pixel project focusing on the lessons learned and the main challenges towards production, from sensors and mechanics structures, and it will summarize the latest results on closest-to-real demonstrators built using module, electric and cooling services prototypes.

