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PoS(TIPP2014)092

Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules

A. Karadzhinova, A. Nolvi, J. Härkönen, P.R. Luukka, T. Mäenpää, E. Tuominen, E. Haeggstrom, J. Kalliopuska, S. Vahanen, I. Kassamakov

in Technology and Instrumentation in Particle Physics 2014

Contribution: pdf