PoS - Proceedings of Science
Volume 313 - Topical Workshop on Electronics for Particle Physics (TWEPP-17) - Production Testing and Reliability
Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade
K. Dunne*, M. Garcia-Sciveres and T. Heim
Full text: pdf
Pre-published on: March 05, 2018
Published on: March 20, 2018
Abstract
A quad chip module hybrid assembled with FE-I4B chips has been fabricated to test performance in a serially powered module chain as would be used in the upgraded ATLAS pixel layer at the High Luminosity LHC. This poster present results of the development of a flex circuit board interface for the quad chip modules and system integration tests of modules installed on an I-beam. Experience from these hybrid assemblies will inform the design of a flex hybrid for the new large format readout chip, RD53A, which will be produced in 2017 by the RD53 collaboration.
DOI: https://doi.org/10.22323/1.313.0065
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