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Volume 370 - Topical Workshop on Electronics for Particle Physics (TWEPP2019) - Packaging and Interconnects
Power hybrids for silicon modules with macro-pixel and strip sensors for the CMS Phase-2 tracker upgrade
K. Klein
Full text: pdf
Pre-published on: 2020 March 09
Published on:
Open Access
Creative Commons LicenseCopyright owned by the author(s) under the term of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.