PoS - Proceedings of Science
Volume 370 - Topical Workshop on Electronics for Particle Physics (TWEPP2019) - Production, Testing and Reliability
Automated assembly of large double-sided microstrip detectors of the CBM Silicon Tracking System at FAIR
P. Pfistner,* T. Blank, R. Speck, M. Weber on behalf of the CBM Collaboration
*corresponding author
Full text: pdf
Pre-published on: March 06, 2020
Published on: April 21, 2020
The detector modules of the Silicon Tracking System of the Compressed Baryonic Matter experiment at FAIR comprise double-sided silicon microstrip sensors with a size of up to 124 mm x 62 mm. Due to tight material budget constraints, the sensors are connected to the read-out electronics by long flexible microcables. As manual assembly of the modules is time-consuming and difficult, a fully customized in-house bonder machine has been developed which allows for a highly automated detector module assembly. We present the requirements and the setup of the bonder machine together with the achieved alignment accuracy and first assemblies.
DOI: https://doi.org/10.22323/1.370.0072
How to cite

Metadata are provided both in "article" format (very similar to INSPIRE) as this helps creating very compact bibliographies which can be beneficial to authors and readers, and in "proceeding" format which is more detailed and complete.

Open Access
Creative Commons LicenseCopyright owned by the author(s) under the term of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.