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Volume 370 - Topical Workshop on Electronics for Particle Physics (TWEPP2019) - Production, Testing and Reliability
Automated assembly of large double-sided microstrip detectors of the CBM Silicon Tracking System at FAIR
P. Pfistner,* T. Blank, R. Speck, M. Weber on behalf of the CBM Collaboration
*corresponding author
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Pre-published on: 2020 March 06
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The detector modules of the Silicon Tracking System of the Compressed Baryonic Matter experiment at FAIR comprise double-sided silicon microstrip sensors with a size of up to 124 mm x 62 mm. Due to tight material budget constraints, the sensors are connected to the read-out electronics by long flexible microcables. As manual assembly of the modules is time-consuming and difficult, a fully customized in-house bonder machine has been developed which allows for a highly automated detector module assembly. We present the requirements and the setup of the bonder machine together with the achieved alignment accuracy and first assemblies.
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