Automated assembly of large double-sided microstrip detectors of the CBM Silicon Tracking System at FAIR
March 06, 2020
April 21, 2020
The detector modules of the Silicon Tracking System of the Compressed Baryonic Matter experiment at FAIR comprise double-sided silicon microstrip sensors with a size of up to 124 mm x 62 mm. Due to tight material budget constraints, the sensors are connected to the read-out electronics by long flexible microcables. As manual assembly of the modules is time-consuming and difficult, a fully customized in-house bonder machine has been developed which allows for a highly automated detector module assembly. We present the requirements and the setup of the bonder machine together with the achieved alignment accuracy and first assemblies.
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