Module and System Test Development for the Phase-2 ATLAS ITk Pixel Upgrade
March 06, 2020
April 21, 2020
In the high-luminosity era of the Large Hadron Collider, the instantaneous luminosity is expected to reach unprecedented values, resulting in up to 200 proton-proton interactions in a typical bunch crossing. To cope with the resulting increase in occupancy, bandwidth and radiation damage, the ATLAS Inner Detector will be replaced by an all-silicon system, the Inner Tracker (ITk). The innermost part of the ITk will consist of a pixel detector, with an active area of about 13 m 2 . In order to cope with the changing requirements in terms of radiation hardness, power dissipation and production yield, several different silicon sensor technologies will be employed in the five barrel and endcap layers. With the arrival of the first readout chip prototype, the RD53A chip, the development of hybrid detector modules is starting to address numerous production issues, understanding of which will be crucial for the layout and production of the final ITk pixel detector modules. In addition, the new powering scheme is serial which gives further challenges. A large prototyping programme on system test level is ongoing. Components for larger structures with multiple modules based on the FE-I4 front-end chips were produced and are under evaluation. This contribution presents the latest development from the assembly and characterisation of prototype modules as well as the latest evaluation and results of fully electrical prototypes.
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