PoS - Proceedings of Science
Volume 213 - Technology and Instrumentation in Particle Physics 2014 (TIPP2014) - Novel Technologies
Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules
A. Karadzhinova*, A. Nolvi, J. Härkönen, P. Luukka, T. Mäenpää, E. Tuominen, E. Haeggstrom, J. Kalliopuska, S. Vahanen and I. Kassamakov
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Published on: July 03, 2015
DOI: https://doi.org/10.22323/1.213.0092
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