Main Image
Volume 348 - The 27th International Workshop on Vertex Detectors (VERTEX2018) - Main session
Construction and Quality Assurance of the Belle II Silicon Vertex Detector
R. Pk,* H. Aihara, T. Aziz, S. Bacher, S. Bahinipati, E. Barberio, T. Baroncelli, T. Baroncelli, A.K. Basith, G. Batignani, A. Bauer, P.K. Behera, V. Bertacchi, S. Bettarini, B. Bhuyan, T. Bilka, F. Bosi, L. Bosisio, A. Bozek, F. Buchsteiner, G. Caria, G. Casarosa, M. Ceccanti, D. Cervenkov, T. Czank, N. Dash, M. De Nuccio, Z. Dolezal, F. Forti, M. Friedl, B. Gobbo, J.A.M. Grimaldo, K. Hara, T. Higuchi, C. Irmler, A. Ishikawa, H.B. Jeon, C. Joo, M. Kaleta, J. Kandra, K.H. Kang, P. Kodys, T. Kohriki, I. Komorov, M. Kumar, R. Kumar, P. Kvasnicka, C. La Licata, K. Lalwani, L. Lanceri, J.Y. Lee, S.C. Lee, Y. Li, J. Libby, T. Lueck, P. Mammini, A. Martini, S.N. Mayekar, G.B. Mohanty, T. Morii, K.R. Nakamura, Z. Natkaniec, Y. Onuki, W. Ostrowicz, A. Paladino, E. Paoloni, H. Park, K. Prasanth, A. Profeti, K.K. Rao, I. Rashevskaya, G. Rizzo, M. Rozanska, D. Sahoo, J. Sasaki, N. Sato, S. Schultschik, C. Schwanda, J. Stypula, J. Suzuki, S. Tanaka, H. Tanigawa, G.N. Taylor, R. Thalmeier, T. Tsuboyama, P. Urquijo, L. Vitale, K. Wan, M. Watanabe, S. Watanuki, I.J. Watson, J. Webb, J. Wiechczynski, S. Williams, H. Yin, L. Zani On behalf of the BELLE II SVD collaboration
*corresponding author
Full text: pdf
Pre-published on: 2019 September 03
Published on: 2019 September 06
Abstract
The Belle II experiment, which is situated at the interaction point of the SuperKEKB $e^+e^{-}$ collider at KEK, Tsukuba, Japan, is expected to collect data corresponding to an integrated luminosity of 50~ab$^{- 1}$. This data set will be sensitive to beyond-the-standard-model physics via precision measurements and searches for very rare decays. At its heart lies a six-layer vertex detector consisting of two layers of pixel detectors (PXD) and four layers of double-sided silicon microstrip detectors (SVD). Precise vertexing as provided by this device is essential for measurements of time-dependent $CP$ violation. Crucial aspects of the SVD assembly are precise alignment, as well as rigorous electrical and geometrical quality assurance. We present an overview of the construction of the SVD, including the precision gluing of SVD component modules and the wire-bonding of various electrical components. We also discuss the electrical and geometrical quality assurance tests.
DOI: https://doi.org/10.22323/1.348.0051
Open Access
Creative Commons LicenseCopyright owned by the author(s) under the term of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.